Attached files
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EX-99.1 - PRESS RELEASE - ULTRATECH INC | d374286dex991.htm |
EX-10.1 - PATENT ASSIGNMENT AGREEMENT - ULTRATECH INC | d374286dex101.htm |
UNITED STATES
SECURITIES AND EXCHANGE COMMISSION
Washington, D.C. 20549
FORM 8-K
CURRENT REPORT
Pursuant to Section 13 OR 15(d) of the
Securities Exchange Act of 1934
Date of Report (Date of earliest event reported): June 26, 2012
Ultratech, Inc.
(Exact name of registrant as specified in its charter)
Delaware | 0-22248 | 94-3169580 | ||
(State or other jurisdiction of incorporation) |
(Commission File Number) | (IRS Employer Identification No.) | ||
3050 Zanker Road, San Jose, California | 95134 | |||
(Address of principal executive offices) | (Zip Code) | |||
Registrants telephone number, including area code (408) 321-8835 |
Not Applicable
(Former name or former address, if changed since last report)
Check the appropriate box below if the Form 8-K filing is intended to simultaneously satisfy the filing obligation of the registrant under any of the following provisions (see General Instruction A.2. below):
¨ | Written communications pursuant to Rule 425 under the Securities Act (17 CFR 230.425) |
¨ | Soliciting material pursuant to Rule 14a-12 under the Exchange Act (17 CFR 240.14a-12) |
¨ | Pre-commencement communications pursuant to Rule 14d-2(b) under the Exchange Act (17 CFR 240.14d-2(b)) |
¨ | Pre-commencement communications pursuant to Rule 13e-4(c) under the Exchange Act (17 CFR 240.13e-4(c)) |
Item 1.01 Entry into a Material Definitive Agreement.
On June 26, 2012, Ultratech, Inc. (the Company) entered into a Patent Assignment Agreement (the Agreement) by and between the Company and International Business Machines Corporation (IBM), a customer of the Company. Pursuant to the Agreement, on June 28, 2012 the Company acquired the rights to a collection of patents from IBM, including patents in packaging such as C4 bumping, Ball Grid Arrays, lead-free solders and 3D packaging. Representing both U.S. and foreign patents, the portfolio includes claims directed at methods of making, at compositions and at structures of semiconductor devices. The Company paid $8,000,000 for the rights to the patents. The Agreement is filed as Exhibit 10.1 to this Current Report on Form 8-K, and is incorporated herein by reference.
On June 28, 2012, the Company issued a press release announcing the acquisition of the patent rights described above. The press release is attached hereto as Exhibit 99.1 and is incorporated herein by reference.
Item 9.01 Financial Statements and Exhibits.
(d) | Exhibits |
10.1 | Patent Assignment Agreement between Ultratech, Inc. and IBM. | |
99.1 | Press release. |
SIGNATURES
Pursuant to the requirements of the Securities Exchange Act of 1934, the Registrant has duly caused this report to be signed on its behalf by the undersigned, hereunto duly authorized.
Date: June 28, 2012
ULTRATECH, INC. | ||
By: | /s/ Bruce R. Wright | |
Bruce R. Wright | ||
Senior Vice President, Finance and Chief Financial Officer (Duly Authorized Officer and Principal Financial and Accounting Officer |
Exhibit Index
Exhibit |
Description | |
10.1 | Patent Assignment Agreement between Ultratech, Inc. and IBM. | |
99.1 | Press release. |