Attached files
| file | filename |
|---|---|
| 8-K - 8-K - XILINX INC | form8-kfeb112014.htm |
| EX-99.1 - REDEMPTION - XILINX INC | exhibit991redemption.htm |
Exhibit 99.2
Investor Relations Contact:
Lori Owen
Xilinx, Inc.
(408) 879-6911
ir@xilinx.com
XILINX RAISES QUARTERLY DIVIDEND $0.04 PER SHARE
SAN JOSE, CA, February 11, 2014-- Xilinx, Inc. (Nasdaq: XLNX) today announced that its Board of Directors declared a quarterly cash dividend of $0.29 per outstanding share of common stock, an increase from the current dividend of $0.25 per share. The quarterly dividend increase will be effective in the June quarter, payable on June 4, 2014 to all stockholders of record at the close of business on May 14, 2014. “This is the ninth time Xilinx has increased the quarterly dividend since we initiated the program in 2004, demonstrating our continued commitment to return of shareholder value,” said Moshe Gavrielov, Xilinx President and Chief Executive Officer.
This release contains forward-looking statements and projections. Forward-looking statements and projections can often be identified by the use of forward-looking words such as “expect,” “believe,” “may,” “will,” “could,” “anticipate,” “estimate,” “continue,” “plan,” “intend,” “project” or other similar expressions. Undue reliance should not be placed on such forward-looking statements and projections, which speak only as of the date they are made. We undertake no obligation to update such forward-looking statements. Actual events and results may differ materially from those in the forward-looking statements and are subject to risks and uncertainties including customer acceptance of our new products, current global economic conditions, the strength of our customers and the end markets in which they participate, our ability to consistently generate sufficient cash flows and other risk factors listed in our most recent Forms 10-K and 10-Q.
About Xilinx
Xilinx develops All Programmable technologies and devices, beyond hardware to software, digital to analog, and single to multiple die in 3D ICs. These industry leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information visit www.xilinx.com.
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